For a good transmitter, not only high performance indicators are required, but also good long-term stability. The stability of the transmitter depends on factors such as the rationality of the design, the performance of the components, and the manufacturing process of the whole machine. The stability of the transmitter is gradually exposed during long-term use. For example, surface contamination of silicon wafers, unstable structure, solder voids, mismatch of thermal resistance between chip and shell, etc. The aging process of the transmitter is an effective means to improve the stability and reliability of the transmitter. Through the transmitter aging test, the defects of the transmitter components, welding and assembly and other hidden dangers in the production process can be exposed in advance, so as to ensure that the transmitter can stand the test of time. The aging test of the transmitter generally includes high-temperature storage aging, high-low temperature cycle aging, high-low temperature impact aging and high-temperature power aging. Among them, high-temperature power aging is an effective means to power the transmitter, simulate the actual working conditions, and detect the potential faults of the transmitter components after a few hours in a low temperature environment of about -40 °C or a high temperature environment of about 80 °C. As a transmitter manufacturer, we conduct a full range of aging tests on transmitters, grasp their aging time, and lay a solid foundation for improving transmitter and quality, reducing device costs, and improving product competitiveness. If you have any questions about product consultation, product customization, agency, technical inquiry, quotation, etc., please contact Xingyi, 400-600-4496!